ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,089, issued on July 14, was assigned to Resonac Corp. (Tokyo). "Adhesive sheet, production method for adhesive sheet, roll, and production ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,090, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Susceptor for process chamber" was invented by Zhepe... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,091, issued on July 14, was assigned to NIPPON ELECTRIC GLASS Co. LTD. (Shiga, Japan). "Support glass substrate and laminated substrate usi... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,092, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Apparatus for processing substrate and method of transferring substra... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,093, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Method for creating product-like stressed surrogate test wafers" was ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,094, issued on July 14, was assigned to INGENTEC Corp. (Miaoli County, Taiwan). "Micro-LED wafer testing device and micro-LED wafer testing... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,095, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "In-situ integrated wafer parameter detection system ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,096, issued on July 14, was assigned to Korea Advanced Institute of Science and Technology (Daejeon, South Korea). "Method of manufacturing... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,098, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Multi-function etching sacrific... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,099, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Method of multi-layer die stacking with die-to-wafer... Read More